I. Overview

Epoxy resin heating plate is also called epoxy glass fiber heating plate, epoxy phenolic laminated glass cloth heating plate. Electrical performance is stable under high humidity. It is suitable for high-insulation structural parts for machinery, electrical appliances and electronics, with high mechanical and dielectric properties, good heat resistance and moisture resistance. Heat-resistant grade F (155 degrees) is deformed by heat at a high temperature of 180 ° C. Specification thickness: 0.5 ~ 100mm.

2. Features

1. Various forms. A variety of resins, curing agents, and modifier systems are available to suit virtually every application's form requirements, ranging from very low viscosities to high melting point solids.

2. Easy to cure. Using a variety of curing agents, epoxy resin systems can be cured in the temperature range of 0 to 180 °C.

3. Strong adhesion. The existence of polar hydroxyl and ether bonds inherent in the molecular chain of epoxy resin makes it have high adhesion to various substances. Epoxy resins have low shrinkage when cured and generate little internal stress, which also contributes to improved adhesion strength.

4. Low shrinkage. The reaction of the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization of epoxy groups in the resin molecule, without the release of water or other volatile by-products. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

5. Mechanical properties. The cured epoxy resin system has excellent mechanical properties.

3. Application areas

Due to its high insulation performance, high structural strength and good sealing performance, epoxy resin has many unique advantages, and has been widely used in the insulation and packaging of high and low voltage electrical appliances, motors and electronic components.

Technical parameter